(BGA/LED SMD Rework System)
HÃNG: SEAMARK ZM
MODEL: ZM-R720
Seamark ZM offers BGA Rework Station since 2005, we have manual, semi-automated and automated bga rework systems with high precision, and user-friendly operation interface, it’s easy to setup and use. Seamark ZM BGA rework station capable of a wide range of board and component including BGA, CSP, QFN, Flip Chips, POP (Package on Package), Micro-SMD (0201, 01005).
ZM-R720/720A BGA/LED SMD Rework System
- Stable and Uniform Hot Air Heating System
- Lower Heater Adjustable
- Carbon Fiber Micro-crystalline Infrared Preheater
- High-Precision PID Temperature Control System
- High-Precision Optical Alignment System with Industrial High-Definition CCD (2MP)
- High-Resolution Touch Screen HMI Interface
- Automatic Placement, Soldering, Desoldering
- Built-In Pressure Testing Device to Protects the PCB
- Real-time Temperature Monitoring and Over-Temperature Protection.
- Emergency Stop Function
- SMD Feeding Device Support (Optional)
- Add a side camera, more clearly observe the rework process(Optional)
Application
Suitable for Normal SMD(BGA, QFP etc.) & Micro-SMD Components Repair, Support P08 Small pitch LED beads, Min. 0.5mm * 0.5mm IC.
Technical Parameters
Item | ZM-R720A |
---|---|
Operation Mode | Automatic / Optical /Touch Panel |
Voltage/Power | AC220V±10%(110V Optional), 50/60HZ / Top: 1200W, Bottom: 1200W, IR: 3200W |
Heating Mode | Top/Bottom Nozzle Hot Air, Bottom Plates Infrared |
Temperature Precision | 2-3 ℃ (1 Sensor Port) |
Preheat Zone | 280×380mm |
Optical Alignment Precision | 0.01MM |
CCD Magnification | 5X~50X |
LCD Display | 17〞1080P FHD LCD Display |
For PCB Size/Chip Size | PCB Size: 415*370MM~6*6MM / Chip Size: 0.6*0.6~40*40MM |
Machine Dimension | L640*W630*H920 (MM) |
Net Weight | 71KG |
Standard Wooden Packing | Packing Size: L750*W700*H950 (MM) / G.W: 120KG |